BLC Inline

Premium Inline Reflow Vapour Phase Soldering Oven

The BLC inline model is an environmentally friendly and flexible
system for high quality soldering. The most complex soldering
applications can be easily mastered with this machine. A high mix of
large and small components can simultaneously get soldered without
overheating any of them. This machine can be fully integrated into a
production line and if necessary also be used in the batch mode. The
Intelligent Profiling System gives the user full control of temperature
rise to reach the best soldering profiles. Together with the unique
patented Soft Vapour Phase there is no fear of exceeding
temperature increase rates of components. Their outstanding low
energy consumption and exhaust air volume compared to other
soldering systems result in even lower running costs. Excellent heat
transfer in an inert oxygen free atmosphere without the need of costly
nitrogen. The two-chamber system with a large user-friendly touch
display makes this machine easy to set up and use. Soldering is
possible regardless of assembly weight with the same profile.

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	Caractéristiques (Fr)	Specifications (Eng)
Width		2020 mm (75.73“)
Depth		2490 mm (98.03“)
Height		1470 mm (57.87“)
Weight		920 kg (2028.25 lbs)
Max. PCB size inline modus		630 x 400 x 55 mm (24.80 x 15.75 x 2.17“)
Max. PCB size batch mode		650 x 540 x 80mm (25.59 x 21.26 x 3.15”)
Max. load on single carrier		7 kg (15.43 lbs)
Liquid agent filling		20 kg (40.10 lbs)
Water connection		½” / 2,5 – 5 bar
Max. heating capacity		7,8 kW
Average power consumption		3,2 kW/h
Power supply		400 / 230 VAC, 50/60Hz
Main fuse		20A „gl“ or „C“

	Caractéristiques (Fr)	Specifications (Eng)
Process extensions • Infrared pre–heating • Variety of options for pcb cooling • Patented Rapid Cooling System (RCS) • Up to 3 additional temperature measurement channels • Multi–Level Mode for rapid switching between different soldering heights • Nitrogen flooding of the cooling and process chamber Software extensions • Online Temperature Recording Software (TRS) for data analysis and storage including alarm and event log • Pilot mode, measurement channel for easy temperature–controlled soldering and setting up of profiles • Heating power monitoring • Various traceability extensions, for automated processes and tracking, ready for Industry 4.0 Hardware extensions • Automatic adjustment of transport lane width and work piece carrier • Larger transport width • Measurement carrier for thermal profiling • Batch carrier and stainless–steel grid • Adapter for double sided boards on batch carrier • TE–Adapter for simple plug–in of PCB–thermocouples • Heavy Duty “HD” model for loads up to 14 kg • Exhaust system extensions • UPS – Uninterruptable Power Supply • ReSy – a device for repair of QFPs BGAs • 2nd Emergency Stop • Storage compartment for carrier • Integration of a bypass system • Chiller for inside or outside use with automatic standby control

Caractéristiques (Fr)

Specifications (Eng)

Process extensions
• Infrared pre–heating
• Variety of options for pcb cooling
• Patented Rapid Cooling System (RCS)
• Up to 3 additional temperature measurement channels
• Multi–Level Mode for rapid switching between different soldering heights
• Nitrogen flooding of the cooling and process chamber

Software extensions
• Online Temperature Recording Software (TRS) for data analysis and storage including alarm and
event log
• Pilot mode, measurement channel for easy temperature–controlled soldering and setting up of
profiles
• Heating power monitoring
• Various traceability extensions, for automated processes and tracking, ready for Industry 4.0

Hardware extensions
• Automatic adjustment of transport lane width and work piece carrier
• Larger transport width
• Measurement carrier for thermal profiling
• Batch carrier and stainless–steel grid
• Adapter for double sided boards on batch carrier
• TE–Adapter for simple plug–in of PCB–thermocouples
• Heavy Duty “HD” model for loads up to 14 kg
• Exhaust system extensions
• UPS – Uninterruptable Power Supply
• ReSy – a device for repair of QFPs BGAs
• 2nd Emergency Stop
• Storage compartment for carrier
• Integration of a bypass system
• Chiller for inside or outside use with automatic standby control

pyrox-division-electronique-ibl-gamme-blc-low.pdf

Features

• Comfortable 15” Touch–Screen mounted on a swiveling arm
• Integrated PC, allows permanent data collection and professional data management
• Permanent data collection
• Unlimited program memory with a large amount of sample programs
• Network capable
• Password protected operation levels
• Energy management system
• Intelligent Profiling System (IPS) for high–end thermal profile control
• Buffer in the loading and unloading areas
• Automatic loading and unloading Work Piece Carrier
• Signal light tower
• Patented vibration and maintenance free transport system
• Two chamber design and medium recovery results in a very low fluid consumption
• Fluid level control and automatic filtering
• Integrated cooling fans
• Minimal maintenance and wear due to all moving parts mounted outside of the process chamber
• Easy access to solder chamber for cleaning and maintenance purposes
• Observation window into the solder chamber
• Exhaust connection
• Cool handling – transport system in cool area

Le groupe

Nous avons la capacité de proposer à nos clients une approche « de bout en bout » grâce à nos compétences techniques et à l’expérience de nos équipes.