The MINILAB is an automated table top reflow soldering machi ne in which the heat is transferred by condensing vapou r. The system is compliant for profiling with standardized manuf acturing specifications without the necessity of program or par ameter set-up. Thanks to the low soldering temperature and h omogeneous heat transfer, the thermal stress on soldering assemblies is kept at the minimum. Together with its simple and safe soldering process this unit is ideal for the use in the development and prototyping. This entry system is a manu al top loader, includes standard soldering profiles and is easy t o move. Soldering is possible regardless of assembly weight.
| Caractéristiques (Fr) | Specifications (Eng) | |
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Width |
715 mm (28.15“) |
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Depth |
625 mm (24.61“) |
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Height |
580 mm (22.83“) |
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Weight |
70 kg (154.32 lbs) |
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Max. PCB size |
304 x 274 x 80 mm (11.97 x 10.79 x 3.14“) |
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Max. load on single carrier |
2 kg (4,41 lbs) |
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Liquid agent filling |
3 kg (6,61 lbs) |
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Water connection |
½“ / 2,5-5 bar |
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Max. heating capacity |
1,8 kW |
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Average power consumption |
0,8 kW/h |
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Power supply |
208-240 VAC, 50/60 Hz |
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Main fuse |
16A „gl“ or „C“ |
| Caractéristiques (Fr) | Specifications (Eng) | |
|---|---|---|
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• Adapter for double sided PCBs |
• Oxygen free soldering without overheating of components
• Patented maintenance and vibration free transport system
• Patented closure of the solder chamber during the load and unloading process
• Fluid recovery system
• Illuminated window into the process chamber
• Patented automatic or time-controlled soldering process
• 5” HMI touch panel
• Several steps within a program
• Program storage including standard soldering profiles
• SD slot for storing of profiles and machine data
• Easy maintenance
Features
We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.
A unique and advanced technological solution dedicated to the oxidation phase involved in the manufacture of VCSELs
