The SV260 is an automated table top reflow soldering machine
with two chamber design in which the heat is transferred by
condensing vapour. The system is compliant for profiling with
standardized manufacturing specifications without the necessity
of program or parameter set-up. Thanks to the low soldering
temperature and homogeneous heat transfer, the thermal stress
on soldering assemblies is kept at the minimum. Together with its
simple and safe soldering process this unit is ideal for the use in
the development and prototyping. This entry system is a manual
front loader, includes standard soldering profiles and is easy to
move. Soldering is possible regardless of assembly weight.
| Caractéristiques (Fr) | Specifications (Eng) | |
|---|---|---|
|
Width |
770 mm (30.31“) |
|
|
Depth |
710 mm (27.95“) |
|
|
Height |
680 mm (26.77“) |
|
|
Weight |
110 kg (242.51 lbs) |
|
|
Max. PCB size |
260 x 300 x 70 mm (10.24 x 11.81 x 2.76“) |
|
|
Max. load on single carrier |
2,5 kg (5,51 lbs) |
|
|
Liquid agent filling |
3 kg (6,61 lbs) |
|
|
Water connection |
½“ / 2,5-5 bar |
|
|
Max. heating capacity |
2,1 kW |
|
|
Average power consumption |
0,9 kW/h |
|
|
Power supply |
208-240 VAC, 50/60 Hz |
|
|
Main fuse |
16A „gl“ or „C“ |
| Caractéristiques (Fr) | Specifications (Eng) | |
|---|---|---|
|
• Adapter for double sided PCBs |
• Oxygen free soldering without overheating of components
• Patented maintenance and vibration free transport system
• Patented automatic or time-controlled soldering process
• Integrated cooling fan
• 5” HMI touch panel
• Program storage including standard soldering programs
• Illuminated observation window into the solder chamber
• SD slot for storing of profiles and machine data
• Exhaust connection
• Cool handling – transport system in cool area
Features
We are able to offer our clients an end-to-end approach thanks to our technical skills and the experience of our teams.
A unique and advanced technological solution dedicated to the oxidation phase involved in the manufacture of VCSELs
